I want to preface this by saying that I'm very new at PCB design so please bear with me . The error I received from FAB manufacturer was this:" While performing DFM validation we observed that under size copper pads provided for all 12Mils via holes. Attached snap shot for your quick reference. Here the annular ring results zero mils and will lead to break out. Please provide sufficient copper pads to have sufficient annular ring (at least via size + 6Mils )and resend the updated gerber data." I don't fully understand what the problem is and how to fix it. Should I be able to see the drill hole on the layout? From what I understand I need to ensure that the via sizing is such that it has at least 6 Mils clearance from the drill hole. I am able to increase the VIA pad size but im not sure how to alter the drill hole in ORCAD LAYOUT. I was thinking of adjusting the pad sizing for either DRLDWG or DRILL layer, but I'm not sure what the difference between the layers are. Thanks !![]()
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