I made a four layer board. I also made a shape in layer 2 that I defined as ground (0V) I need to perforate the “ground” plane with vias to connect layer 1 to layers 3 and 4 without making contact with layer 2 (gnd). I observed the following error(s) DRC error "Shape to Thu Via Spacing" Layer 2 Constraint value 0.127mm Actual value: 0mm Where in constraint manager may I fix the following problem? Is this a problem with the "shape" or the "via"? If this a simple fix, then please contact me and tell me what a foolish things that I have done. .
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