usually the padring is connected by abutment, meaning the simple act of having the pad cells placed together in a ring is what connects the padring, provided you have IO fillers in any gaps, and corner cells that continue the rails around the corners, etc. Core power and IO power are usually different voltages, and therefore different sources, but VSS is usually shared (but it can be separate - depends on the design). If you have a flip-chip, the power bumps will have to be routed to the IO pads, but sroute is not used for that.![]()
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