Want to see the exciting technology that is behind some of the biggest innovations at CES? Book a meeting now to visit the Cadence invitation-only suites at CES 2018, January 9-12, South Hall 2, Suite MP2577 (same location as last year). See Tensilica-based products in action! You’ll have the opportunity to view exciting demonstrations of our latest technologies, discuss your plans and requirements for on-device artificial intelligence (AI)/neural network, convolutional neural networks, vision, audio, radar/lidar, and other DSP-based products and meet with key Cadence business and technology leaders. Find out how Tensilica DSPs can make an impact in your next SoC design, giving you the highest performance and lowest power. AI, CNN, and Vision Demonstration of AI/neural network processing on the Tensilica Vision P6 DSP platform Demonstration of advanced imaging experiences on the Tensilica Vision P6 DSP platform HiFi Audio Demonstration of ultra-low-power always-on voice activation running on a Tensilica HiFi DSP on the leading consumer tablets and smartphones Demonstration of a smart speaker integrating Sensory’s voice activation and Alexa Voice Services with Realtek’s ALC5680 codec chip based on the Tensilica HiFi DSP Demonstration of Waves Nx 3D/AR audio, which delivers a lifelike audio experience on headphones, turning them into a high-end 360˚ surround-sound system and enabling you to experience your favorite movies, music, and games with real-world 3D sound We will also feature recently announced consumer products that are powered by Tensilica DSPs. Book your meeting now!![]()
↧